Our company's development tools are designed to help our customers' IO-Link development. Our development tools cover the fields of:

  • Physical layer testing (testing of electrical, signal form, etc.) 
  • Protocol tests (supporting IO-Link test specification testcases on Data-Link layer and Application layer)
  • EMC Test devices (special EMC test device and EMC hardened test master)
  • All tester suites generate automatic reports in PDF format, providing you with a test report in a ready-to-deliver electronic format. 

Safety Master Tester

Safety Master Tester

Overview

Every manufacturer of IO-Link Safety Masters needs to run tests specified in the current IO-Link Safety Test specification V1.1.3 successfully as precondition for the assessment of a named body (e.g., TÜV). Precondition for Safety tests are the Standard IO-Link Master Tests that are executed by a different tool.

IO-Link Test Specification describes tests of the Safety Communication Layer “SCL” based on test vectors that were automatically generated and approved by a named body (IFAK tests).

To run the Safety Tests, the Master Manufacturer must implement an Upper Tester (UT) and an SMI Test Communication Server.

The IFAK test vectors are submitted by the Safety Master Tester Unit to the Master Under Test. Some additional Test cases, such as the Splitter / Composer test are triggered via the STCS.

Safety Master Tester Features

  • Test system for automated, reproducible Safety Master tests according to the latest IO-Link Safety Test specification
  • PDF Report Generation
  • Simultaneous test of multiple ports supported (requires additional MTUs)
  • SDK for SMI Test Communication Server
  • Maintenance extension provided
  • Option for additional SMTUs

Safety Master Tester Advantages

  • Highly automated test of IO-Link Masters
  • Automatic report generation
  • Support of Safety assessment of named bodies
  • One year maintenance included

Test Master für EMV Konformitätstests

The IO-Link specification includes well-defined procedures for testing the EMC robustness of IO-Link devices.

Some tests check the sensitivity of the IO-Link communication of IO-Link devices under EMC conditions.

This requires a robust master that is much less sensitive to EMC noise than the device under test.

This is achieved by separating the IO-Link master into two parts: part 1 contains the sensitive digital logic  (µC- box), part 2 contains the IO-Link transceiver (PHY-box).

Both parts are separated by an optical connection with a length of up to 10m.

EMC Test System for Devices Features

  • Complies to IO-Link interface specification V1.1.2 and V1.1.3 and the current IO-Link test specification V1.1.3
  • Error and Signal output
  • 4 electrical IO-Link port configurations
    • COM1/2 speed port (good signal)
    • COM1/2 speed port (bad signal)
    • COM3 speed port (good signal)
    • COM3 speed port (bad signal)
  • RS232 and USB interfaces
  • Terminal based control command set
  • Additional EMC test and control software with graphical user interface
  • Test report generation in PDF Format
  • Can be configured to operate as standard "USB IO-Link Master"
  • Firmware update supported

Advantages

  • Sensitive Parts are located outside EMC chamber
  • EMC robustness considerably better than required

Test-Device für EMV-Konformitätstest

The IO-Link Interface Specification V1.1.3 defines a specific Test Device (see Appendix H.2.2 Test of a Master) that shall be connected to an IO-Link Master during the execution of EMC tests.

Functional Description

The device generates an 8-bit random number which is read out by the master. During the test the master shall return this random number to the device in the next IO-Link cycle.

The device checks whether it receives the correct random number and increments an internal error counter if not. The error counter is also incremented if a checksum error or a parity error is detected on the Device side.

The error count can be read out by the Master via an IO-Link parameter after the test. In addition, the error counter value is displayed by a 7-segment indicator.

When an error is detected, the Device generates a trigger signal to an optical output. A trigger box that converts the optical signal into a trigger pulse can be connected to the device. The trigger pulse supports developers in identifying possible issues on the Master side.

The Device can be configured to operate in one of 3 COM-speeds by DIP-Switches or by IO-Link Parameters.

EMC Test Device Features

  • Device fully compliant to V1.1.3 IO-Link Interface Specification
  • All 3 COM-Speeds supported (via Switch Selector and IO-Link Parameter)
  • Internal Pseudo-Random-Number Generators
  • Error counter for Parity, Checksum, Data and Time-out Errors
  • 7-Segment Error Counter Display
  • 7-Segment Device Status Display
  • Error Counter accessible via IO-Link
  • Optical Error Trigger Output
  • Additional support of round-trip delay measurements
  • Total error counts and maximum error counts within standardized group of M-Sequences separately available via IO-Link. Two group sizes selectable per COM-Speed

Advantages

  • Better time-to-market
  • Identification of EMC issues

IODD Studio

IODD-Designer

IO-Link devices need to be described by IO-Link Device Descriptions called "IODD". These IODD are complex structured XML files with numerous restrictions and interdependencies. Editing an IODD can become a laborious and tedious task and it is difficult to maintain integrity between device and IODD in case of modifications.

TEConcept has developed an IODD Studio that simplifies the editing of IODDs significantly.

The IODD Studio is a flexible tool which lets the user create the desired IODD and only gives feedback about errors found by the custom validators. For this reason, this tool is recommended for users with experience working with IODD files. The IODD Studio supports creation of new IODDs from scratch as well as import and modification of existing IODDs. The user can also customize the validation rules that are enforced on the created IODD.

Created / modified IODDs can be checked and "stamped" by using the "official" IODD checker from the IO-Link webpage.

IODD Studio Features

  • Complies to IO-Link Interface Specification V1.1.3
  • Wireless IODD Support
  • Configurable IODD Validators
  • Current project status can be saved and restored
  • Integrated IODD Finder
  • IOLFW Package Creator
  • Integrated XML Viewer / Editor
  • BLOB Transfer Profile Support
  • Identification & Diagnosis Profile Support
  • Import elements from existing IODDs
  • Installer for Windows 7/8/10

Advantages

  • Speed up of IODD editing
  • XML know how not required
  • Import and modification of IODDs supported
  • Flexibility
  • Configurable input validation
  • Vendor specific IODD Template creation

FWBD Application Tester

FWBD App Tester

Overview

The IO-Link Profile BLOB Transfer & Firmware Update Specification Version 1.1 September 2019 specifies an update procedure for IO-Link Devices. The update procedure must be implemented by a Software Application that has control over an IO-Link Master. Test procedures for that Software application have been specified. 

To execute these test procedures, a special Device, the FWUP App Tester, has been specified. 

TEConcept has developed a compliant Test Device including all required test files.

FWBD App Tester Features

  • Test system for semi-automatic, reproducible Link Master tests according to IO-Link Profile BLOB Transfer & Firmware Update Specification Version 1.1 September 2019
  • Verification of good case
  • Verification of error handling
  • Approved by IO-Link community

FWBD App Tester Advantages

  • Assures correct operation of FWUP Application
  • Checks for correct error handling
  • Reduces risk for malfunction in the field
  • Visual indication of current firmware variant

TEConcept Serial Transport Layer (TSTL)

Overview

The TEConcept Serial Transport Layer “TSTL” connects a separated IO-Link Stack controller to a Host system running on an application microprocessor.

Description

We have designed a software module for low latency transfer of IO-Link Standard Master Interface Services (SMI) of multiple IO-Link Ports over one serial communication line in an error-robust manner.

TSTL Features

  • IO-Link V1.1.3 compatible
  • Standard Master Interface “SMI” support
  • Sample & Hold synchronization with Ports
  • Non-blocking client-side process data access
  • CRC based retransmission scheme
  • Both full-duplex and half-duplex data transfer
  • Configurable, fixed telegram length
  • Independent channel for on-request-data
  • API needs only 3 interface functions
  • Mostly symmetric design
  • Currently support for SPI, UART and Ethernet
  • C-99 compatible source code

TSTL Advantages

  • Extendible to other serial interfaces
  • Simultaneous support of multiple IOL-ports with different cycle times
  • Deterministic, fast process data exchange
  • Independent Parameter/Event processing
  • Data access with DMA supported
  • Communication seamlessly resumed, if one side temporarily halts operation.
  • Immune to transmission errors
  • Multiple instances on client-side

SMI Communication Client

Overview

The TEConcept Serial Transport Layer “TSTL” connects a separated IO-Link Stack controller to a Host system running on an application microprocessor.

Description

We have designed a software module for low latency transfer of IO-Link Standard Master Interface Services (SMI) of multiple IO-Link Ports over one serial communication line in an error-robust manner.

SMI Communication Client Features

  • IO-Link V1.1.3 compatible
  • Standard Master Interface “SMI” support
  • Sample & Hold synchronization with Ports
  • Non-blocking client-side process data access
  • CRC based retransmission scheme
  • Both full-duplex and half-duplex data transfer
  • Configurable, fixed telegram length
  • Independent channel for on-request-data
  • API needs only 3 interface functions
  • Mostly symmetric design
  • Currently support for SPI, UART and Ethernet
  • C-99 compatible source code

SMI Communication Client Advantages

  • Extendible to other serial interfaces
  • Simultaneous support of multiple IOL-ports with different cycle times
  • Deterministic, fast process data exchange
  • Independent Parameter/Event processing
  • Data access with DMA supported
  • Communication seamlessly resumed, if one side temporarily halts operation.
  • Immune to transmission errors
  • Multiple instances on client-side

Control Tool 4.0

Control Tool 4.0

Overview

The TEConcept Control Tool 4.0 supports configuration of IO-Link Devices based on IO-Link Device Descriptor files, the electronic data sheets in the IO-Link world.

Description

Parameterization of IO-Link Devices via IO-Link Masters, using the TEConcept IO-Link Master Stacks or a supported communication interface. For Windows 7 and newer PCs.

Control Tool 4.0 Features

  • Multiple Masters supported
  • Fully compatible to V1.1.3 Masters
  • Port configuration storable
  • Supports Ethernet, USB, UART, I2C, SPI,…
  • TEConcept Serial Transport Layer Support
  • Firmware Download support (option)
  • Plug-In concept for customer specific functional extensions (e.g., BLOB transfers for FFT)
  • Event and Message Log Windows
  • C/Q and I/Q support
  • IODD and IODD Finder support
  • Process Data Variants supported

Control Tool 4.0 Advantages

  • Full featured tested Master Control
  • Available as:
  • Stand-alone app
  • Extension module to existing automation software
  • Local IODD catalogue for operation without Internet access
  • Optional IODD checking
  • User Role support

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